General Information
-
Mechanical design
Module design implement (reduce assembling cost and failure rate, speed up project schedule, avoid the impact of tariffs between China and US)
-
TWS+ technology
New Wireless architecture (eliminate the need for cross-head Bluetooth transmission by simultaneously connecting the Mobile device to both earbuds and reduce power consumption and latency)
-
ANC function
Feedforward ANC
-
LSR molding technology (optional)
New concept for earphone housing implement (achieve one-piece molding, better for waterproof design, improve drop ability and soft housing offer comfortable wearing)
Capability
Support True wireless stereo plus connection
Better power consumption control
Stable and be used for several branding TWS earphone
BT5.0 version for better software support and customization for ODM customers
Innovative mechanical design to improve production process
LSR ability, achieve one-piece molding
Advantage:
-
Acoustic tuning capability
-
Plastic tooling injection skill
-
Mechanical patent
Mechanical Design (Both TWS+ and TWS)
Module A (Inner mold)
Combine PCBA and Battery.
Charging pad pitch is 2~3 mm, universal design for charging box and earphone
Design for traditional top and bottom housing architecture.
Module A: Combine PCBA and Battery (Size is 12.17 x 17.17 x 11.6 mm)
Module B (Inner mold)
Combine PCBA, Battery and Speaker.
Charging pad pitch is 2~3 mm, universal design for charging box and earphone
Design for innovative liquid silicone rubber(LSR) technology.
Module B: Combine PCBA, Battery and Speaker (Size is 16.75 x 17.42 x 20.4 mm)
